Resin penetration through submicrometer hiatus structures: a SEM and CLSM study.

Abstract

The purpose of this study was to confirm the existence of submicrometer hiatus structures and to examine the degree of resin penetration through these formations. Dentin disks 2.0 mm in thickness were sectioned from 48 human molars with the use of a microtome saw. Three different fifth-generation (total-etch, combined primer/resin) dentin adhesive systems were used to bond a light-cured, resin-based composite to the dentin disks (n = 16 each group). Bonded disks from the three groups were then sectioned. Half of each group was examined with the use of a scanning electron microscope (SEM) (n = 8), and the other half with the use of a confocal laser scanning microscope (CLSM) (n = 8). The frequency of submicrometer hiatus formation was recorded and documented with associated imaging techniques. Resin penetration within submicrometer hiati were observed in 41.7% (10/24) of SEM specimens and 83.3% (20/24) of CLSM specimens. The location and size of these structures were found to be quite uniform. Submicrometer hiati approximated 200 microm in each of the three dentin bonding systems examined. Resin penetration through submicrometer hiati does not appear to be an artifact of desiccation. These structures were clearly identified within the hybrid layer of each dentin adhesive system used in this study.