High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction.

Cameron, Neil S; Roberge, Helene; Veres, Teodor; Jakeway, Stephen C; John Crabtree, H · Lab Chip · 2006

basic_science · Level V

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Abstract

We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.