Design of reversible cross-linkers for step and flash imprint lithography imprint resists.

Abstract

Progress in the semiconductor manufacturing industry depends upon continuous improvements in the resolution of lithographic patterning through innovative materials development and frequent retooling with expensive optics and radiation sources. Step and Flash Imprint Lithography is a low-cost, nanoimprint lithography process that generates nanopatterned polymeric films via the photopolymerization of low-viscosity solutions containing cross-linking monomers in a transparent template (mold). The highly cross-linked imprint materials are completely insoluble in all inert solvents, which poses a problem for reworking wafers with faulty imprints and cleaning templates contaminated with cured imprint resist. Degradable cross-linkers provide a means of stripping cross-linked polymer networks. The controlled degradation of polymers containing acetal- and tertiary ester-based cross-linkers is demonstrated herein. The viscosity and dose to cure are presented for several prepolymer formulations, along with imprint resolution and tensile modulus results for the cured polymers. Optimum conditions for de-cross-linking and stripping of the cross-linked polymers are presented, including demonstrations of their utility.