High-density stretchable electronics: toward an integrated multilayer composite.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 20717983.
- Also identified by DOI 10.1002/adma.201000515 and PMC identifier 3271703.
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Abstract
High-density stretchable electronics is achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics—increasing integration density and improving electrical bonding—have been addressed by our innovative multilayer via-bonding technology. The resulting multichip-module architecture provides an elastic, high-density solution for numerous potential applications.
Medical subject headings
- Elasticity
- Electrical Equipment and Supplies