Directed 2D-to-3D pattern transfer method for controlled fabrication of topologically complex 3D features in silicon.

Rykaczewski, Konrad; Hildreth, Owen J; Wong, Ching P; Fedorov, Andrei G; Scott, John Henry J · Adv Mater · 2011

basic_science · Level V

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Abstract

A process that allows control over the 3D motion of catalyst nanostructures during metal-assisted chemical etching by their local pinning prior to etching is demonstrated. The pinning material acts as a fulcrum for rotation of the catalyst structures resulting in etching of silicon features with rotational geometry.

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