Hierarchical three-dimensional layer-by-layer assembly of carbon nanotube wafers for integrated nanoelectronic devices.
basic_science · Level V
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- Record sourced from PubMed, PMID 22889469.
- Also identified by DOI 10.1021/nl3016472.
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Abstract
We report a general approach to overcome the enormous obstacle of the integration of CNTs into devices by bonding single-walled carbon nanotubes (SWNTs) films to arbitrary substrates and transferring them into densified and lithographically processable "CNT wafers". Our approach allows hierarchical layer-by-layer assembly of SWNTs into organized three-dimensional structures, for example, bidirectional islands, crossbar arrays with and without contacts on Si, and flexible substrates. These organized SWNT structures can be integrated with low-power resistive random-access memory.
Medical subject headings
- Crystallization
- Electronics
- Nanotechnology
- Nanotubes, Carbon