Facile preparation of high-performance elastically stretchable interconnects.
basic_science · Level V
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- Record sourced from PubMed, PMID 25995085.
- Also identified by DOI 10.1002/adma.201501461.
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Abstract
Sites on poly(dimethylsiloxane) are selected by ultraviolet exposure. In a subsequent electroless deposition, solid silver films are created on the selected sites only. In this way, facile vacuum-free deposition of electrodes from the liquid phase and their photoresist- and solvent-free patterning are realized. The technique enables reliable rigid-to-soft interconnects that are reversibly stretchable under arbitrary and changing stretching directions.