Flexible Lamination Encapsulation.

Park, Min-Ho; Kim, Jin-You; Han, Tae-Hee; Kim, Tae-Sik; Kim, Hobeom; Lee, Tae-Woo · Adv Mater · 2015

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Abstract

A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods.