Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory.

Kim, Do Hyun; Yoo, Hyeon Gyun; Hong, Sung Min; Jang, Bongkyun; Park, Dae Yong; Joe, Daniel J; Kim, Jae-Hyun; Lee, Keon Jae · Adv Mater · 2016

basic_science · Level V

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Abstract

Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.