Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 28798970.
- Also identified by DOI 10.1039/c7sm01256j.
- No licence information is recorded for this record.
- Because redistribution is not established, this page shows the abstract only. Follow the links below for the full text.
Abstract
We report the patterning of copper surfaces which display both superhydrophobicity and high adhesion thanks to a new feature geometry, and without resorting to chemical modification. Polystyrene beads organized in 2D crystals under an AC electric field act as a template for the growth of copper deposited via cupric ion-loaded multi-lamellar vesicles. After the removal of the beads, hexagonal arrays of supported hollow spheres or copper bowls are generated, depending on the amount of deposited copper. While the bowl-covered surfaces display a predictable decreasing wettability (Cassie model) as their wall height increases, the hollow sphere-covered surfaces exhibit both high adhesion and superhydrophobicity (Cassie-Baxter state).