Electrically reversible cracks in an intermetallic film controlled by an electric field.

Liu, Z Q; Liu, J H; Biegalski, M D; Hu, J-M; Shang, S L; Ji, Y; Wang, J M; Hsu, S L et al. · Nat Commun · 2018

basic_science · Level V

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Abstract

Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 10<sup>8</sup> is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 10<sup>7</sup> cycles under 10-μs pulses, without catastrophic failure of the film.