Low Resistivity and High Breakdown Current Density of 10 nm Diameter van der Waals TaSe<sub>3</sub> Nanowires by Chemical Vapor Deposition.

Empante, Thomas A; Martinez, Aimee; Wurch, Michelle; Zhu, Yanbing; Geremew, Adane K; Yamaguchi, Koichi; Isarraraz, Miguel; Rumyantsev, Sergey et al. · Nano Lett · 2019

basic_science · Level V

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Abstract

Micron-scale single-crystal nanowires of metallic TaSe<sub>3</sub>, a material that forms -Ta-Se<sub>3</sub>-Ta-Se<sub>3</sub>- stacks separated from one another by a tubular van der Waals (vdW) gap, have been synthesized using chemical vapor deposition (CVD) on a SiO<sub>2</sub>/Si substrate, in a process compatible with semiconductor industry requirements. Their electrical resistivity was found unaffected by downscaling from the bulk to as little as 7 nm in nanowire width and height, in striking contrast to the resistivity of copper for the same dimensions. While the bulk resistivity of TaSe<sub>3</sub> is substantially higher than that of bulk copper, at the nanometer scale the TaSe<sub>3</sub> wires become competitive to similar-sized copper ones. Moreover, we find that the vdW TaSe<sub>3</sub> nanowires sustain current densities in excess of 10<sup>8</sup> A/cm<sup>2</sup> and feature an electromigration energy barrier twice that of copper. The results highlight the promise of quasi-one-dimensional transition metal trichalcogenides for electronic interconnect applications and the potential of van der Waals materials for downscaled electronics.