3D printable tough silicone double networks.

Wallin, Thomas J; Simonsen, Leif-Erik; Pan, Wenyang; Wang, Kaiyang; Giannelis, Emmanuel; Shepherd, Robert F; Mengüç, Yiğit · Nat Commun · 2020

basic_science · Level V

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Abstract

Additive manufacturing permits innovative soft device architectures with micron resolution. The processing requirements, however, restrict the available materials, and joining chemically dissimilar components remains a challenge. Here we report silicone double networks (SilDNs) that participate in orthogonal crosslinking mechanisms-photocurable thiol-ene reactions and condensation reactions-to exercise independent control over both the shape forming process (3D printing) and final mechanical properties. SilDNs simultaneously possess low elastic modulus (E<sub>100%</sub> < 700kPa) as well as large ultimate strains (dL/L<sub>0</sub> up to ~ 400 %), toughnesses (U ~ 1.4 MJ·m<sup>-3</sup>), and strengths (σ ~ 1 MPa). Importantly, the latent condensation reaction permits cohesive bonding of printed objects to dissimilar substrates with modulus gradients that span more than seven orders of magnitude. We demonstrate soft devices relevant to a broad range of disciplines: models that simulate the geometries and mechanical properties of soft tissue systems and multimaterial assemblies for next generation wearable devices and robotics.

Medical subject headings