Two-Tier Compatibility of Superelastic Bicrystal Micropillar at Grain Boundary.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 33078611.
- Also identified by DOI 10.1021/acs.nanolett.0c03486.
- No licence information is recorded for this record.
- Because redistribution is not established, this page shows the abstract only. Follow the links below for the full text.
Abstract
Both crystallographic compatibility and grain engineering are super critical to the functionality of shape memory alloys, especially at micro- and nanoscales. Here, we report a bicrystal CuAl<sub>24</sub>Mn<sub>9</sub> micropillar engraved at a high-angle grain boundary (GB) that exhibits enhanced reversibility under very demanding driving stress (about 600 MPa) over 10 000 transformation cycles despite its lattice parameters are far from satisfying any crystallographic compatibility conditions. We propose a new compatibility criterion regarding the GB for textured shape memory alloys, which suggests that the formation of GB compatible twin laminates in neighboring textured grains activates an interlock mechanism, which prevents dislocations from slipping across GB.