Nano-crumples induced Sn-Bi bimetallic interface pattern with moderate electron bank for highly efficient CO<sub>2</sub> electroreduction.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 35513361.
- Also identified by DOI 10.1038/s41467-022-29861-w and PMC identifier 9072316.
- Licence recorded as CC BY.
- The licence permits redistribution, so the abstract is shown in full and the full text is available from the publisher.
Abstract
CO<sub>2</sub> electroreduction reaction offers an attractive approach to global carbon neutrality. Industrial CO<sub>2</sub> electrolysis towards formate requires stepped-up current densities, which is limited by the difficulty of precisely reconciling the competing intermediates (COOH* and HCOO*). Herein, nano-crumples induced Sn-Bi bimetallic interface-rich materials are in situ designed by tailored electrodeposition under CO<sub>2</sub> electrolysis conditions, significantly expediting formate production. Compared with Sn-Bi bulk alloy and pure Sn, this Sn-Bi interface pattern delivers optimum upshift of Sn p-band center, accordingly the moderate valence electron depletion, which leads to weakened Sn-C hybridization of competing COOH* and suitable Sn-O hybridization of HCOO*. Superior partial current density up to 140 mA/cm<sup>2</sup> for formate is achieved. High Faradaic efficiency (>90%) is maintained at a wide potential window with a durability of 160 h. In this work, we elevate the interface design of highly active and stable materials for efficient CO<sub>2</sub> electroreduction.