Ag<sub>2</sub>Se as a tougher alternative to n-type Bi<sub>2</sub>Te<sub>3</sub> thermoelectrics.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 39097572.
- Also identified by DOI 10.1038/s41467-024-50898-6 and PMC identifier 11297924.
- Licence recorded as CC BY.
- The licence permits redistribution, so the abstract is shown in full and the full text is available from the publisher.
Abstract
For half a century, only Bi<sub>2</sub>Te<sub>3</sub>-based thermoelectrics have been commercialized for near room temperature applications including both power generation and refrigeration. Because of the strong layered structure, Bi<sub>2</sub>Te<sub>3</sub> in particular for n-type conduction has to be texturized to utilize its high in-plane thermoelectric performance, leaving a substantial challenge in toughness. This work presents the fabrication and performance evaluation of thermoelectric modules based on n-type Ag<sub>2</sub>Se paring with commercial p-Bi<sub>2</sub>Te<sub>3</sub>. Ag<sub>2</sub>Se mechanically allows an order of magnitude larger fracture strain and thermoelectrically secures the module efficiency quite competitive to that of commercial one for both refrigeration and power generation within ± 50 K of room temperature, enabling a demonstration of a significantly tougher alternative to n-type Bi<sub>2</sub>Te<sub>3</sub> for practical applications.