A Versatile Microporous Design toward Toughened yet Softened Self-Healing Materials.
basic_science · Level V
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- Record sourced from PubMed, PMID 39460439.
- Also identified by DOI 10.1002/adma.202410650.
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Abstract
Realizing the full potential of self-healing materials in stretchable electronics necessitates not only low modulus to enable high adaptivity, but also high toughness to resist crack propagation. However, existing toughening strategies for soft self-healing materials have only modestly improves mechanical dissipation near the crack tip (Г<sub>D</sub>), and invariably compromise the material's inherent softness and autonomous healing capabilities. Here, a synthetic microporous architecture is demonstrated that unprecedently toughens and softens self-healing materials without impacting their intrinsic self-healing kinetics. This microporous structure spreads energy dissipation across the entire material through a bran-new dissipative mode of adaptable crack movement (Г<sub>A</sub>), which substantially increases the fracture toughness by 31.6 times, from 3.19 to 100.86 kJ m<sup>-2</sup>, and the fractocohesive length by 20.7 times, from 0.59 mm to 12.24 mm. This combination of unprecedented fracture toughness (100.86 kJ m<sup>-2</sup>) and centimeter-scale fractocohesive length (1.23 cm) surpasses all previous records for synthetic soft self-healing materials and even exceeds those of light alloys. Coupled with significantly enhanced softness (0.43 MPa) and nearly perfect autonomous self-healing efficiency (≈100%), this robust material is ideal for constructing durable kirigami electronics for wearable devices.