Immersion Phase-Change Liquid Cooling Devices Based on Copper Microgroove/Nanocone Composite Structure.
basic_science · Level V
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- Record sourced from PubMed, PMID 39869309.
- Also identified by DOI 10.1021/acs.nanolett.4c05588.
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Abstract
Along with the rapid development of the digital economy and artificial intelligence, heat sinks available for immersion phase-change liquid cooling (IPCLC) of chips are facing huge challenges. Here, we design a high-performance IPCLC heat sink based on a copper microgroove/nanocone (MGNC) composite structure. Maximal heat fluxes (<i>q</i><sub>max</sub>) of the MGNC structure, microgroove structure, and flat copper reach 112.7, 88.0, and 24.0 W·cm<sup>-2</sup> as the surface temperature (<i>T</i><sub>S</sub>) of the simulated chip heat source rises up to 85 °C, respectively. As compared to the flat copper, the nanocone structure shows much higher cooling efficacy but lower cooling capacity, with <i>q</i><sub>max</sub> = 19.8 W·cm<sup>-2</sup> at <i>T</i><sub>S</sub> = 69.8 °C. Structure-performance relationships are rationalized by combined experiments and theoretical analyses. This work not only helps deeply understand the respective roles of microscale and/or nanoscale structures in IPCLC but also provides the state-of-the-art solution with the best IPCLC performance as compared to all peers' reports.