Back-End-of-Line-Compatible Passivation of Sulfur Vacancies in MoS<sub>2</sub> Transistors Using Electron-Withdrawing Benzenethiol.
basic_science · Level V
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- Record sourced from PubMed, PMID 39899701.
- Also identified by DOI 10.1021/acsnano.4c12927.
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Abstract
Atomically thin two-dimensional semiconductor molybdenum disulfide (MoS<sub>2</sub>) is considered an ideal n-type channel material for field-effect transistors (FETs) due to its immunity to short-channel effects by dangling bond-free surface. However, sulfur atom dissociation or nonideal film deposition can easily lead to sulfur vacancies (SVs) in the MoS<sub>2</sub> film. These crystal imperfections create defects in the electronic structure, thereby limiting the utility of this promising material. We introduce an electron-withdrawing benzenethiol (BT) to repair the vacancies with the exact missing atoms at 200°C─marking the lowest process temperature for complete SV repair. These thiol groups actively and selectively bond with the vacant sites due to their self-assembly nature. Notably, we found that the fluorination of BT weakens the S-C bond as the BT withdraws electrons from the sulfur side. This enables a low-temperature annealing process to detach the headgroups from the MoS<sub>2</sub> surface. The atomic ratio of MoS<sub>2</sub> was recovered from 1.68 to 1.98, leading to an ideal subthreshold swing of MoS<sub>2</sub> FETs 62.5 mV·dec<sup>-1</sup>. The proposed SV repair process, repeatedly applicable between fabrication steps for its low process temperature, unveils the potential of the BEOL MoS<sub>2</sub> FETs with a nearly ideal atomic ratio adhering to their thermal budget.