Ferroelectric tunnel junctions integrated on semiconductors with enhanced fatigue resistance.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 40215315.
- Also identified by DOI 10.1126/sciadv.ads0724 and PMC identifier 11988404.
- Licence recorded as CC BY-NC.
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Abstract
Oxide-based ferroelectric tunnel junctions (FTJs) show promise for nonvolatile memory and neuromorphic applications, making their integration with existing semiconductor technologies highly desirable. Furthermore, resistance fatigue in current silicon-based integration remains a critical issue. Understanding this fatigue mechanism in semiconductor-integrated FTJ is essential yet unresolved. Here, we systematically investigate the fatigue performance of ultrathin bismuth ferrite BiFeO<sub>3</sub> (BFO)-based FTJs integrated with various semiconductors. Notably, the BFO/gallium arsenide FTJ exhibits superior fatigue resistance characteristics (>10<sup>8</sup> cycles), surpassing the BFO/silicon FTJ (>10<sup>6</sup> cycles) and even approaching epitaxial oxide FTJs (>10<sup>9</sup> cycles). The atomic-scale fatigue mechanism is revealed as lattice structure collapse caused by oxygen vacancy accumulation in BFO near semiconductors after repeated switching. The enhanced fatigue-resistant behavior in BFO/gallium arsenide FTJ is due to gallium arsenide's weak oxygen affinity, resulting in fewer oxygen vacancies. These findings provide deeper insights into the atomic-scale fatigue mechanism of semiconductor-integrated FTJs and pave the way for fabricating fatigue-resistant oxide FTJs for practical applications.