Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 40367155.
- Also identified by DOI 10.1126/sciadv.adv0057 and PMC identifier 12077495.
- Licence recorded as CC BY.
- The licence permits redistribution, so the abstract is shown in full and the full text is available from the publisher.
Abstract
The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (<i>R</i><sup>2</sup> = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.