Modulating the Electronic Transport of 2D Sb<sub>2</sub>Te<sub>3</sub> Nanoplates by Coinage Metal Intercalation.
basic_science · Level V
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- Record sourced from PubMed, PMID 40404604.
- Also identified by DOI 10.1021/acs.nanolett.5c01540.
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Abstract
Thermoelectric materials are particularly relevant to the current energy infrastructure and demands of the 21st century, converting waste heat into usable electricity. The solution intercalation of zerovalent copper into Sb<sub>2</sub>Te<sub>3</sub> nanoplates, a well-established thermoelectric material, is reported. The copper intercalant is homogeneously distributed throughout the nanoplates, confirmed by scanning transmission electron microscopy coupled with energy-dispersive X-ray spectroscopy. The copper composition was shown to be 6 at. % by X-ray photoelectron spectroscopy. Copper ordering within the van der Waals gaps of the nanoplates is confirmed by selected area electron diffraction. Fabrication and thermoelectric property measurements of single-crystal Sb<sub>2</sub>Te<sub>3</sub> and Cu-Sb<sub>2</sub>Te<sub>3</sub> nanoplate devices show effective modulation of electrical conductivity and Seebeck coefficient with Cu intercalation. X-ray photoelectron spectroscopic studies in the valence-band region reveal additional electronic states from copper that appear near the Fermi energy, postulated to act as electron acceptors, leading to modulation of the electronic transport properties.