Dynamically autofocused 3D pulsed laser micromachining enables advanced 3D bioelectronics.

Abstract

Advancing next-generation bioelectronic interfaces requires devices that are soft, miniaturized, and seamlessly integrated with biological tissues. However, conventional fabrication methods, primarily based on UV photolithography, struggle to meet these needs, relying on hazardous chemicals, labor-intensive processes, and planar, layer-by-layer construction. To overcome these limits, we introduce dynamically autofocused 3D pulsed laser micromachining (d-3DPLM) using a nanosecond pulsed near-infrared laser. This approach enables rapid, cost-effective structuring of diverse materials, including thin films, metal foils, and bulk metal blocks, supporting monolithic, multilayer bioelectronics with complex 3D architectures such as microneedles and deployable elements. d-3DPLM achieves high-resolution ablation and patterning for conformable and functional device geometries. Demonstrated applications include electro-haptic patches, in vitro multielectrode diagnostic arrays, and wireless contact lenses for red light therapy. By broadening the design and manufacturing landscape for bioelectronic systems, this versatile method paves the way for improved performance, unique functionality, and enhanced integration with living tissue.