Efficient thermal management of electronic devices by constructing interlayer phonon bridges.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 41298407.
- Also identified by DOI 10.1038/s41467-025-65554-w and PMC identifier 12658045.
- Licence recorded as CC BY-NC-ND.
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Abstract
Layered film-based thermal management materials with high in-plane thermal conductivity can effectively diffuse point heat sources and prevent local overheating. However, their low through-plane thermal conductivity limits its overall heat dissipation. Here, we introduce a honeycomb-gel densification strategy that forms zigzag yet continuous interlayer phonon bridges within the layered structure. This design establishes bi-directional thermal pathways, boosting both in-plane and through-plane thermal conductivity by 488.9% and 503.3% of the aramid nanofiber/boron nitride nanosheet, respectively, compared to random-gel densified films. Also, the aramid nanofiber/boron nitride nanosheet film exhibits high solar reflectivity, infrared emissivity, and thermal radiation, enabling efficient subambient cooling (17.2 °C at 100 mW/cm²) for heat-generating devices.