Integration of Imprint-Free and Low Coercivity Ferroelectric BaTiO<sub>3</sub> Thin Films on Silicon.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 41506630.
- Also identified by DOI 10.1021/acs.nanolett.5c05139 and PMC identifier 12833864.
- Licence recorded as CC BY.
- The licence permits redistribution, so the abstract is shown in full and the full text is available from the publisher.
Abstract
Highly crystalline ferroelectric oxides integrated on Si hold great promise for energy-efficient memory and logic technologies. Exploiting epitaxial strain engineering in these materials is, however, severely hampered on Si, where the large structural mismatch often results in an inferior interfacial quality and causes degradation of the ferroelectric switching characteristics. In this work, we present the growth of single-crystalline BaTiO<sub>3</sub> thin films on Si, exhibiting imprint-free switching, low coercivity, high remanent polarization, and no fatigue for over 10<sup>10</sup> switching cycles. We accomplish this via the insertion of a SrSn<sub>1-<i>x</i></sub>Ti<sub><i>x</i></sub>O<sub>3</sub> layer on SrTiO<sub>3</sub>-buffered Si. This layer serves as a pseudosubstrate that alleviates the thermal strain that the Si substrate imposes on the BaTiO<sub>3</sub> layer, while simultaneously providing moderate compressive strain that stabilizes a pure out-of-plane polarization. Thus, our work paves the way toward the fabrication of Si-compatible, low-power-consuming ferroelectric devices.