Wafer-Scale All-Dielectric Quasi-BIC Metasurfaces: Bridging High-Throughput Deep-UV Lithography with Nanophotonic Applications.
basic_science · Level V
Where this comes from
- Record sourced from PubMed, PMID 41650320.
- Also identified by DOI 10.1021/acs.nanolett.5c05226 and PMC identifier 12922174.
- Licence recorded as CC BY.
- The licence permits redistribution, so the abstract is shown in full and the full text is available from the publisher.
Abstract
High quality-factor (Q) dielectric metasurfaces operating in the visible to near-infrared range require sub-200 nm features, limiting fabrication to expensive, low-throughput electron beam lithography. Here, we demonstrate wafer-scale metasurfaces fabricated using deep ultraviolet lithography (DUVL), a workhorse technology in the semiconductor industry. Using a radius and depth perturbation technique in a hole array patterned into a silicon nitride slab, we achieve quasi-bound states in the continuum (qBIC) resonances with measured Q-factors of 150. We introduce DUV exposure dose as a Q-factor engineering parameter and demonstrate how hole depth control circumvents DUVL resolution limits. Despite stochastic nanoscale variations, the fabricated metasurfaces exhibit spatial uniformity, a consequence of the nonlocal nature of the qBIC resonances. Refractive index sensing demonstrates 129 nm/RIU sensitivity while maintaining CMOS camera-based resonance shift interrogation. This work bridges scalable semiconductor manufacturing with high-performance nanophotonics, establishing a practical pathway for commercializing metasurface-based biosensors, on-chip spectrometers, and integrated photonic systems.