Flexible and Thermally Regulable High-Temperature Sensing Electronics.

Abstract

Emulating flexible sensing in integrated systems operating under high-temperature environments is challenging due to the degraded stability of flexible materials and interfaces at increased temperatures. Here, we propose a strategy to design and construct flexible stacking architectures by using an inkjet printing and thermal annealing approach. The <i>in situ</i> growth of highly conductive molybdenum patterns directly on flexible micas afforded strong bonding and adhesion between circuits and flexible substrates. Thermal stress mismatch was significantly suppressed, enhancing the stability and signal-to-noise ratios of flexible devices up to 400 °C. Flexible and thermally regulable electronic devices, including amplifiers, low-pass filters, and wave generators, were constructed for high-temperature applications. Additionally, the seamless integration of these devices with a machine learning algorithm enables the realization of flexible sensing systems for real-time engine state monitoring and high-temperature information filtering. The proof-of-concept strategy offers a unique route for designing flexible sensing electronic devices, integrated circuits, and systems resistant to extreme-temperature conditions.