Minimal twin structures enabling extraordinary thermoelectric power factor of n-type Bi<sub>2</sub>Te<sub>3</sub> thin films.
basic_science · Level V
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- Record sourced from PubMed, PMID 42091895.
- Also identified by DOI 10.1038/s41467-026-72621-3.
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Abstract
Boosting carrier mobility is essential for achieving high room-temperature thermoelectric performance in n-type Bi<sub>2</sub>Te<sub>3</sub>-based films, which have long exhibited inferior power factors compared with their single crystal counterparts due to poor carrier mobility. To overcome this challenge, we develop a simple substrate surface engineering strategy to fabricate Twin-free n-type Bi<sub>2</sub>Te<sub>3</sub> (000 l) thin films. Atomic-scale analyses and transport measurements uncover that eliminating twin structures avoids twin-induced band bending and severe lattice strain, enabling the simultaneously enhanced carrier mobility and suppressed bipolar conduction. The optimized Twin-free Bi<sub>2</sub>Te<sub>3</sub> film exhibits a high room-temperature carrier mobility of ~279 cm<sup>2 </sup>V<sup>-1</sup> s<sup>-1</sup>, doubling the mobility of films containing twin structures, and consequently achieves an extraordinary room-temperature power factor of ~6.17 mW m<sup>-1</sup> K<sup>-2</sup>. These findings highlight the critical role of minimizing twin structures in boosting the carrier mobility and mitigating bipolar conduction, thereby providing an effective route toward high-performance thermoelectric thin films.