Localized carbon deposition enables trimming of photonic integrated circuits.
basic_science · Level V
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- Record sourced from PubMed, PMID 42168186.
- Also identified by DOI 10.1038/s41467-026-73411-7.
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Abstract
Photonic integrated circuits (PICs), widely used in optical communications and computing, require precise post-fabrication trimming due to their high sensitivity to fabrication imperfections. Focused ion beam (FIB) carbon deposition offers a localized trimming approach with high spatial precision. Here, we demonstrate this technique for the first time to enable non-volatile post-fabrication trimming of PICs. To validate this approach, we use asymmetric directional couplers as representative fabrication-sensitive components. Structural characterizations confirm localized surface deposition without observable modification of the underlying waveguide core, and device measurements show discrete transmission tuning levels of 1.46-16.1 dB. Independent test structures further reveal an additional loss of 0.35 dB per π phase shift, indicating a low optical penalty at the device level. Furthermore, the optical response remains stable over two months following a brief initial settling phase. These results highlight the potential of FIB carbon deposition in device-level trimming and provide a foundation for exploring future trimming strategies toward parallel implementations.