Acid-containing water-in-oil microemulsions for polishing the subsurface damage layer of the KDP single crystal.
basic_science · Level V
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- Record sourced from PubMed, PMID 42740643.
- Also identified by DOI 10.1039/d6sm00663a.
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Abstract
Microemulsions formed by water/polyoxyethylene <i>tert</i>-octylphenyl ether (TX-100)/<i>n</i>-hexanol/<i>n</i>-hexane were characterized and applied to polish the subsurface damage layer of the potassium dihydrogen phosphate (KDP) single crystal. Effects of the mass ratio of TX-100-to-<i>n</i>-hexanol (<i>K</i><sub>m</sub>), pH and temperature on the phase behavior of these systems were studied by pseudo-ternary phase diagrams and dynamic light scattering. The size of a single-phase region area was largest when <i>K</i><sub>m</sub> = 3 : 2, pH = 3, at 25 °C. The type of microemulsions and reactivity between KDP and acid in water-in-oil (W/O) microemulsions (MEs) were determined by conductivity. The salt-carrying capacity of W/O MEs was investigated by acid-base titration. The static etching rate (SER) of the KDP crystal was calculated to be 709.6 nm min<sup>-1</sup>. The micropolarity of W/O MEs was explored by a solvent chromogenic approach. XRD showed that the excess peaks of the subsurface layer of the KDP crystal (200) and (211) were eliminated after polishing. The root mean square roughness (<i>R</i><sub>q</sub>) and arithmetic mean roughness (<i>R</i><sub>a</sub>) of the KDP crystal were reduced from 1.67 nm and 1.19 nm to 1.58 nm and 1.15 nm, respectively.