Different forms of TFIIH for transcription and DNA repair: holo-TFIIH and a nucleotide excision repairosome.
basic_science · Level V
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Abstract
Yeast TFIIH that is active in transcription can be dissociated into three components: a 5-subunit core, the SSL2 gene product, and a complex of 47 kDa, 45 kDa, and 33 kDa polypeptides that possesses protein kinase activity directed towards the C-terminal repeat domain of RNA polymerase II. These three components can reconstitute fully functional TFIIH, and all three are required for transcription in vitro. By contrast, TFIIH that is highly active in nucleotide excision repair (NER) lacks the kinase complex and instead contains the products of all other genes known to be required for NER in yeast: RAD1, RAD2, RAD4, RAD10, and RAD14. This repairosome is not active in reconstituted transcription in vitro and is significantly more active than any of the constituent polypeptides in correcting defective repair in extracts from strains mutated in NER genes.
Medical subject headings
- DNA Repair
- Fungal Proteins
- Saccharomyces cerevisiae
- Saccharomyces cerevisiae Proteins
- TATA-Binding Protein Associated Factors
- Transcription Factor TFIID
- Transcription Factors
- Transcription Factors, TFII
- Transcription, Genetic